MD-R330 Tabletop IR+Convection Reflow Oven

MD-R330 Tabletop IR+Convection Reflow Oven 280mm x 860mm

  • Compact Design: 1400（L）×612（D）×650（H）mm
  • Long Life: Heating zones are made of stainless steel, sustain high temperature and not rust.
  • Digital Control. Control of both the heating temperatures and conveyor speed. 
  • Three top heating zones. Max.
  • PCB width 280mm, power consumption 5KW, IR+convection(IR generated hot air).
  • Easy to operate, small but can make excellent PCB’s.
  • Optimized heating chambers
  • Hot air circulation
  • Multi layers of insulation
MD-330 Specifications & Parameters
Max PCK width280mm
Dimensions:Outside: 1400(L)x612(W)x650(H)mmÊ
Heating chamber length:860mm
Weight:50Kg
Power consumption:5KW
Regular working power:1.8Kw
Power supply:2 phase or 3 phase, 220V, 50/60Hz, 11A
Conveyor:Width: 300mm
Height: 420±20mm
Moving direction:left_right (left_right can be ordered)
Pass through time:4-5 minutes
Speed:relative dial mark: 0-10
Actual moving speed:200-800mm
Usable speed marks:0.5-3
Heating zones:1 Preheat zone, digital control, 1.0Kw
2 Drying zone, digital control, 2.0Kw
3 Reflow zone, digital control, 2.0Kw
Default setting:Solder Paste Glue
1 Preheat zone:210±15 deg C, 200±5 deg C
2 Drying zone:200±10 deg C, 150±5 deg C
3 Reflow zone:235±15 deg C, 150±5 deg C

Heating Model:

The MD series reflow ovens combine hot air with infrared to achieve even heat distribution.

Hot air heating has the following advantages:

  • No shadow areas or dead corners
  • Heat energy is transferred directly onto solder paste and pads
  • Prevent overheat of components
  • Even heat distribution on components
  • Even heat distribution on circuit boards
  • Accommodate different PCB’s, including flex ones

Infra-red heating has the following advantages:

  • Infra-red waveform heats the chamber air directly, reduces heat circulation volume
  • Reduce oxidization of the solder paste
  • Reduce the oven power consumption
  • Short warm up time
  • Infra red waveform keeps the heating chamber cleaning.

Temperature sensors:

  • Every heating zone has its own temperature sensor. It is calibrated in the factory and should not be modified.

Temperature controller:

  • Every heating zone has its own temperature controller.
  • It is a standard PID controller with fuzzy logic function and large driving power SSR (solid state relay).

Packing List:

  • 1 reflow oven MD-R330
  • K-type sensor
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Pick and Place Circuit Board Assembly DP2006-2

DP2006-2 Features

  • Automatic, semi-automatic or manual selection
  • Windows based control software, user friendly interface
  • Single axis precision 0.002″
  • Automatic, semi-automatic or manual selection
  • Windows based control software, user friendly interface
  • Single axis precision 0.002″

Computer, computer monitor and video monitor not included.

Automatic pick and place package includes:

  • One down looking teaching video camera
  • One up looking bottom view camera
  • Computer vision hardware and software
  • One down looking teaching video camera
  • One up looking bottom view camera
  • Computer vision hardware and software

Pick and place machine (automatic or semi-automatic)

  • Comes with 10 SX feeders.
  • Call for lead time

Options:

  • Computer
  • Additional up looking cameras
  • Computer
  • Additional up looking cameras

 The new designed DP2006 has a light weight, precise and fast XYZ movement base, driven by stepper motors.

  • Dispenser
  • Pick and place
  • PCB routing
  • Hot air gun
  • Etc.
  • Different tools can be mounted on it conveniently.

Pick and Place Operations:

  • The pick and place operations are the same as our other pick and place machines if computer vision is equipped.
  • The part can be placed directly on the PCB automatically, or go through the up looking camera for precision alignment.

With manual feeders:

  • The machine sequentially picks up taped parts from the manual feeder.
  • The tape needs to be manually pulled forward for every 20 to 30 parts.
  • IC’s need to be placed on flat manual feeders, pushed into a corner for positioning before they are picked up.

Programming:

  • Pick and place operation can be programmed by the teaching camera, CAD file conversion, or directly moving and placing the part to a position.
  • Click on the computer screen to set the initial position.
  • Fine adjustments are done at testing runs.
  • Automatic feeders, taped or stick, can also be purchased and mounted on the DP2006-2 machine.

Please note that stencil printing is much faster and more suitable for fine pitch components.

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