These days, the needs of customer for processing the thin substrate by using the PCB prototyping machine increases.
It is suitable to use vacuum table when processing on the thin substrate materials.
Two models of the vacuum tables
MITS handles two kinds of vacuum tables. Please choose one in accordance with
your purpose.
Precision model VTP-CRM
Precision vacuum table made of the porous ceramics. Compliant with the 50 µm thickness substrate board. |
 |
Popular model VT-ABS
Popular vacuum table made of the porous plastic resin. Compliant with the substrate board thicker than 200µm |
 |
| Items | VTP-CRM | VT-ABS |
| Working area W x D (mm) | 150 x 120 | 300 x 170 / 229 x 295 |
| The thinnest substrate thickness (µm) | 50 | 200 |
| Material of the porous surface | Ceramic | Plastic resin |
| Vulnerability | Weak | Strong |
| Price | High Value | Affordable |
| Compliant model | FP-21T Precision | FP-21T, FPZ-31AT
/ Eleven Lab, Auto Lab |
The principle of the vacuum table and its advantage
The fundamental principle is shown above.
The advantage is to aspirate the substrate very firmly, instead of fixing them by
Scotch tape.
The porous materials
There are two types of materials; one is made of ceramics, the other is made of
plastic resin.
The ceramic material can be polished in order to improve the surface flatness,
but you cannot polish the plastic material.
Material and the surface flatness
The crucial factor in choosing the vacuum table is the thickness of the substrate board.
In case of processing the thin substrate board, you need to choose the vacuum
table whose surface flatness is sufficient. If the surface flatness is bad, it causes
uneven width of the track or penetration of the tools into the substrate board.
In case that the end mill penetrates the substrate, the vacuum table
will not be able to function
When the surface of the porous table gets damaged, the aspiration performance and the flatness become deteriorate. Therefore, in processing the substrate, we recommend that you should avoid drilling and routing and that you should perform the milling not to penetrate the substrate.
Automatically detects the surface and recognize the Z-axis position where the tip of the end mill makes contact with the substrate board.
Upright image: The image is not reverted.
