we have the fine processing technology for many kinds of material

Besides the PCB, MITS have a proven track record of achieving the fine processing thinner than 100µm on the surface of many materials as following;                         

  • Silicon wafer                           
  • Strontium titanate (100)
  • Acrylic                          
  • Glass                         

These processing consist of a lot of know-how, such as “stepping process technology” in Z-axis

Silicon wafer
Strontium titanate (100)
Even on the extremely thin circuit board

 Glass material  Magnified picture