Besides the PCB, MITS have a proven track record of achieving the fine processing thinner than 100µm on the surface of many materials as following;
- Silicon wafer
- Strontium titanate (100)
- Acrylic
- Glass
These processing consist of a lot of know-how, such as “stepping process technology” in Z-axis
Silicon wafer
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Strontium titanate (100)
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Acrylic
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Even on the extremely thin circuit board
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Glass material | Magnified picture |