Line Proposals
Isolationline Level 1PCB production by isolation milling and mechanical through hole plating |
Basisline Level 1PCB production with mechanical through hole plating |
Basisline Level 2PCBs like in Level 1 plus green solder mask and blue components printing |
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Basisline Level 3PCBs like in Level 2 |
Comfortline Level 3PCB production with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing |
Comfortline XL Level 3PCB production with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing like Basisline Level 3, but optimized on through put for: board size 300 x 400mm! |
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Bungard Profiline Level 3PCB production with negative resist, |
Upgrade Multilayer productionProduction of inner layer and multilayer press lamination |
Flow Chart Multilayer complete
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Bungard Upgrade Artwork ProductionCreate professional artwork in high resolution, perfect sharpness, complete darkness and most accurate dimensions |
Upgrade
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Upgrade
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