Surfaces
Bungard Sur Tin Chemical Tin
The easiest, quickest and cheapest way to protect your pcb is to dip into a Bungard Sur Tin solution.
-> details Sur Tin Chemical Tin
Bungard Green Coat
Green Coat is a new spray coating for all PCBs that are manually soldered
Bungard Sur Tin with Bungard Base material
if you use ORIGINAL BUNGARD positive coated PCBs, we have an interesting technical alternative:
-> details Sur Tin with Bungard Base material
Bungard Solder Mask
We offer the typical green surface finish for printed circuit boards in industrial quality.
Our laminate solder mask is an aqueous alkaline processed dry film mask.
-> details Bungard Solder Mask
Ormecon Chemical Tin
Ormecon immersion tin is a method for chemical tin plating of copper surfaces.
The specialty on Ormecon process is a 0.08 micron thick layer of organic metal.
-> details Ormecon Chemical Tin
Chemical Nickel-Gold (Enig = electroless nickel gold)
Since early 1990s the alloy surface (nickel / phosphorus & gold) is one of the most versatile surfaces. In this method, a nickel layer forms the diffusion barrier between copper and solder alloy.
-> details Chemical Nickel-Gold (Enig = electroless nickel gold)
Galvanic Nickel-Gold
The nickel-gold plating-surface is abrasion-resistant and corrosion free and therefore it is often used for components with increased mechanical stress (male).
-> details Galvanic Nickel-Gold
Surface Comparison
Not every surface is suitable for all application. Here you find an overview on the pros and cons: