Besides the PCB, MITS have a proven track record of achieving the fine processing thinner than 100µm on the surface of many materials as following;                         

• Silicon wafer                           
• Strontium titanate (100)
• Acrylic                          
• Glass                         

These processing consist of a lot of know-how, such as “stepping process technology” in Z-axis

Silicon wafer	Strontium titanate (100)
Acrylic	Even on the extremely thin circuit board
Glass material	Magnified picture