Surface Comparison
| Surface | Layer / Thickness | Application | Costs | Solderability | Storage |
| Sur Tin | 0,8-1,7 μm SN | soldering | ++ | ++ | ca. 6 months |
| Ormecon chem tin |
0,08μm org. metal 0,8-1,2μm SN |
soldering, (Conductive Adhesives), press fit technology | ++ | ++ | >12 months |
| Chem. Nickel Gold |
3-6μmNiP / 70- 120nm Au |
soldering, AL-wire bonds, Conductive Adhesives | – | ++ | >12 months |
| Galv. Gold | 4-6NiP / 0,4- 2μm Au |
Plugs Sanders |
— | — | unlimited |
Comparison Gold Surfaces
| Criteria | chem. Nickel-Gold (ENIG) | chem. Nickel-Thickgold | Hardgold |
| Thickness Gold | 0,075-0,3μ | 0,5-max 1,0μ | 1,0-1,2μ |
| Thickness Nickel | 4-6μ | 4-6μ | 4-6μ |
| Storage | min. 6 months | min. 12 months | min. 12 months |
| Application | Alu wire-Bonding | Alu wire- or Gold-wire-bonding | plugs |
| Property | soft | soft | hard (Kobalt-alloy) |
| costs | medium | medium | high |
| Layouthints | none | none | Goldflächen müssen elektrisch verbunden sein |
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