Flow chart Multilayer complete

Preparation part 1
artwork production
Preparation part 2
Inner layers
PCB standard process
incl. PTH
precut films
(Ne-Cut)
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insert film
(Filmstar)
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convert and arrange
Gerberdatas to Bitmap
(PC)
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start photoplotter
(Filmstar)
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develop, fix, rinse and dry film
(dark room)
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control film
(light table)
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cut films to size
(Ne-Cut)
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Film
Cut raw material to size
(Ne-Cut)
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CNC-drilling of reference holes
on innerlayers, prepregs +
top/bottom layers
(BUNGARD CCD)
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brushcleaning of inner layers
(RBM 402KF/RBM 300)
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laminating of etch resist
(RLM 419p)
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vacuumexposure
(EXP 8000/HELLAS)
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spraydeveloping
(DL500/SPLASH)
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sprayetching
(DL 500/SPLASH CENTER)
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stripping of etchresist
(DL 500S/SPLASH CENTER)
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brushcleaning
(RBM 402KF/RBM 300)
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insert reference pins
(Favorit)
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mulitlayer press lamination
(RMP 210)
CNC-drilling
(BUNGARD CCD)
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brushcleaning
(RBM 402KF/RBM 300)
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galvanic PTH
(COMPACTA)
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brushcleaning
(RBM 402KF/RBM 300)
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lamination of etch resist
(RLM 419p)
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vacuum exposure
(EXP 8000/HELLAS)
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spray developing
(DL 500/SPLASH)
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spray etching
(DL 500/SPLASH CENTER)
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stripping of etch resist
(DL 500S/SPLASH CENTER)
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brush cleaning
(RBM 402KF/RBM 300)
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chemical tinning
(EG 01/SPLASH CENTER)
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lamination of solder mask
(RLM 419p)
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exposure of solder mask
(EXP 8000/HELLAS)
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spray developing
(DL 500/SPLASH)
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curing of soldermask
(EXP 8000/HELLAS/hot air oven)
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CNC-V-cut or CNC-routing
(BUNGARD CCD)