raw material cut to size (Ne-Cut) CNC-drilling and contour routing (BUNGARD CCD/ATC) brushcleaning (RBM 300) galvanic plating through hole (COMPACTA 30 2CU) brushcleaning (RBM 300) lamination of tenting resist (RLM 419p #1) vacuum exposure (HELLAS) spray developing (SPLASH D) spray etching stripping of tenting resist (both SPLASH CENTER) brushcleaning (RBM 300) chemical tinning (SPLASH CENTER) laminating of solder mask (RLM 419p #2) exposure of solder mask (HELLAS) spray developing (SPLASH D) curing of solder mask (HELLAS or hot air oven) CNC-V-cut or contour routing (Bungard CCD/ATC)

System features:

• CCD/ATC for enhanced drilling, COMPACTA 30 2 CU doubles galvanic throughput, a second laminator RLM 419p avoids changing rolls between the steps!
• Fine-line technology in industrial quality with green solder mask and blue components printing!
• (To make components printing repeat again from laminating but with RLM 419p #1 and blue tenting resist)
• Modular upgradeable to multilayer, artwork production, waste water treatment or surface finishing set at any time !
• Track resolution: better 150µm!
• Film production with laser printer or bubble jet or local film supplier.
• Processing time: approx. 2 hours
• maximum throughput: 2,0m² / 8h – more than twice the volume of Basisline 3!
• maximum usable size: 210 x 300 mm