Comfortline Level 3

PCB prouction with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing like Basisline Level 3, but optimized on through put!

Basis_L3_links raw material cut to size
(Ne-Cut)
arrow down2
CNC-drilling and contour routing
(BUNGARD CCD/ATC)
arrow down2
brushcleaning
(RBM 300)
arrow down2
galvanic plating through hole
(COMPACTA 30 2CU)
arrow down2
brushcleaning
(RBM 300)
arrow down2
lamination of tenting resist
(RLM 419p #1)
arrow down2
vacuum exposure
(HELLAS)
arrow down2
spray developing
(SPLASH D)
arrow down2
spray etching
stripping of tenting resist
(both SPLASH CENTER)
arrow down2
brushcleaning
(RBM 300)
arrow down2
chemical tinning
(SPLASH CENTER)
arrow down2
laminating of solder mask
(RLM 419p #2)
arrow down2
exposure of solder mask
(HELLAS)
arrow down2
spray developing
(SPLASH D)
arrow down2
curing of solder mask
(HELLAS or hot air oven)
arrow down2
CNC-V-cut or contour routing
(Bungard CCD/ATC)
Comfort_L3_rechts

System features:

  • CCD/ATC for enhanced drilling, COMPACTA 30 2 CU doubles galvanic throughput, a second laminator RLM 419p avoids changing rolls between the steps!
  • Fine-line technology in industrial quality with green solder mask and blue components printing!
  • (To make components printing repeat again from laminating but with RLM 419p #1 and blue tenting resist)
  • Modular upgradeable to multilayer, artwork production, waste water treatment or surface finishing set at any time !
  • Track resolution: better 150µm!
  • Film production with laser printer or bubble jet or local film supplier.
  • Processing time: approx. 2 hours
  • maximum throughput: 2,0m² / 8h – more than twice the volume of Basisline 3!
  • maximum usable size: 210 x 300 mm