Bungard Profiline Level 3

PCB production with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing

Basis_L3_links raw material cut to size
(Ne-Cut #1)
arrow down2
CNC-drilling and contour routing
(BUNGARD CCD/ATC #2)
arrow down2
brushcleaning
(RBM402KF #3)
arrow down2
galvanic plating through hole
(COMPACTA 40 2CU #4)
arrow down2
brushcleaning
(RBM 402KF #3)
arrow down2
lamination of tenting resist
(RLM 419p #5)
arrow down2
vacuum exposure
(EXP 8000 #6)
arrow down2
spray developing
(DL 500 D #7)
arrow down2
spray etching
(DL 500 #8)
arrow down2
stripping of tenting resist
(DL 500S #9)
arrow down2
brushcleaning
(RBM 402KF #3)
arrow down2
laminating of solder mask
(RLM 419p #10)
arrow down2
exposure of solder mask
(EXP 8000 #6)
arrow down2
spray developing
(DL 500 D #7)
arrow down2
curing of solder mask
(EXP 8000 #6)
arrow down2
CNC-V-cut or contour routing
(BUNGARD CCD/ATC #2)
Profi_L3_rechts

System features:

  • Fine-line technology in industrial quality with green solder mask and blue components printing!
  • (To make components printing repeat again from laminating but with RLM 419p #1 and blue tenting resist)
  • Modular upgradeable to multilayer set, artwork production, waste water treatment or surface finishing at any time !
  • Track resolution: better 150µm!
  • Film production with laser printer or bubble jet or local film supplier.
  • Processing time: approx. 1,5 hours!
  • maximales Plattenformat: 300 x 400 mm !
  • maximum throughput: 4,5m² / 8h!
  • maximum usable size: 300 x 400mm!
[/fusion_builder_column][/fusion_builder_row][/fusion_builder_container]