Basisline Level 3

PCBs like in Level 2
in addition with negative resist and galvanic plating through hole

Basis_L3_links raw material cut to size
(Ne-Cut)
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CNC-drilling and contour routing
(BUNGARD CCD/2)
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brushcleaning
(RBM 300)
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galvanic plating through hole
(COMPACTA 30)
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(RBM 300)
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lamination of tenting resist
(RLM 419p)
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vacuum exposure
(HELLAS)
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spray developing
(SPLASH D)
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spray etching
stripping of tenting resist
(SPLASH CENTER)
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brushcleaning
(RBM 300)
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chemical tinning
(SPLASH CENTER)
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laminating of solder mask
(RLM 419p)
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exposure of solder mask
(HELLAS)
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spray developing
(SPLASH D)
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curing of solder mask
(HELLAS or hot air oven)
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CNC-V-cut or contour routing
(Bungard CCD/2)
Basis_L3_rechts

System features:

  • Fine-line technology in industrial quality with green solder mask and blue components printing!
  • (To make components printing repeat the steps laminating, exposure and developing with blue tenting resist!)
  • Modular upgradeable to multilayer, artwork production, waste water treatment or surface finishing set at any time!
  • Track resolution: better 150µm!
  • Film production with laser printer or bubble jet or local film supplier.
  • Processing time: approx. 2 hours
  • maximum throughput: 0,8m² / 8h
  • maximum usable size: 210 x 300 mm
  • 3 more machines than Level 2: Ne-Cut for board cutting, RBM 300 for cleaning and roughening and COMPACTA 30 for galvanic through hole plating (PTH)