Compacta 30 – Through-hole plating line

Professsional equipment for laboratory prototyping of through-hole plated PCBs up to 210 x 300 mm size. Clean system including built-in rinsing compartment. Maintenance free and made for easy processing and handling. This particular machine type is optimized in terms of space requirements annd costs. Compacta 30 is suitable for the Dexter 3 D process (known on the market as the ABC chemical system). Bigger and customized units are also available (see our web site for COMPACTA 40).

Features

Processing sequence for the ABC panel plating (tenting) technique:

• Cleaner
• Conditioner
• Pre-dip
• Catalyst
• Salt remover
• Copper plate

Equipment:

• 5 treatment tanks, 2 of them with heaters
• 1 galvanic copper bath
• 1 triple-cascade rinse with flow control
• 1 spray rinse tank with magnetic valve, foot switch and flow control
• 1 free tank (i.e. for chemical tinning)

Rectifier:

• 1 Rectifier for copper plating 6 V / 40 A, seperate current and voltage display and setting. Residual ripple < 0.1 % DCU

Bath control:

• 2 PTFE/PFA coated heaters, controlled by analogue instruments
• full digital timers with count-down, auto-reset and beeper
• Air injection into the copper plating bath
• Board movement by DC gear motor, adjustable speed.

Accesories/Options

• Digital timers for each bath (included in delivery!)
• Required accessories (not included in delivery!): Chemicals, anodes, anodes holder and board holder

Technical Data

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